Design of Mixed-Signal Circuits for Wireless Communication Systems and Implanted Neural Devices in 3D Technology
نویسندگان
چکیده
The three-dimensional (3D) integrated circuit technology developed by MIT Lincoln Laboratory allows circuit structure that forms on several silicon-on-insulator (SOI) substrates to be integrated into a 3D integrated circuit. This 3D technology gives the possibility of better thermal and noise management, more compact design, and so on. However, circuit design in the 3D technology has not been fully understood. The design methodology should also be developed in order to capture all the design issue.
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